The **ATS-07F-121-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **pushPIN™** series. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Cooling / Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 9.56°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ### 2. Physical Design & Mounting The "07F" in the part number indicates a specific fin pattern and height profile designed for low-profile applications. * **Cross-Cut Fin Pattern:** The fins are cut both horizontally and vertically. This increases the surface area and allows air to flow from multiple directions, making it more efficient than straight-fin designs in environments where airflow direction might vary. * **Push-Pin Attachment:** Instead of using adhesive tape (which can fail over time) or screws (which require precise threading), this part uses plastic or brass push-pins with springs. This ensures constant pressure between the heat sink and the electronic component, improving thermal transfer. --- ### 3. Electronic Applications This part is typically used to cool high-heat-generating electronic components on a Printed Circuit Board (PCB). Common targets include: 1. **Processors:** Low-power CPUs or high-speed DSPs (Digital Signal Processors). 2. **FPGAs & ASICs:** Field Programmable Gate Arrays that generate significant heat during high-speed logic operations. 3. **Power Electronics:** Voltage regulators or motor drivers that require thermal dissipation to prevent "Thermal Throttling" or hardware failure. 4. **Network Hardware:** Used in switches and routers for cooling chipset controllers. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 9.56 | 5.12 | 3.99 | 3.44 | 3.08 | *Note: As airflow increases, the thermal resistance drops significantly, allowing the component to stay cooler under heavy loads.* ---