The **ATS-07F-122-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Thermal Resistance** | 5.87°C/W (at 100 LFM) | | **Flow Orientation** | Flat Fin (Horizontal/Vertical) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## Key Design Components ### 1. Thermal Performance (C2) The "C2" designation refers to the specific thermal performance and the material used. In this series, it indicates an **Aluminum** construction with a **Blue Anodized** finish, which enhances surface area emissivity and protects the metal from corrosion. ### 2. Attachment System (Push-Pin) Unlike adhesive-based heat sinks, the **R0** variant uses a mechanical push-pin system: * **Brass/Plastic Pins:** Provides a secure mechanical fit to the PCB. * **Compression Springs:** Ensures constant pressure between the heat sink and the component, optimizing heat transfer. * **Required Hole Size:** Usually requires pre-drilled holes in the PCB (typically 3.0mm). ### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a "Phase Change" or high-performance thermal pad that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance compared to air. ### 4. Fin Geometry The **flat-fin design** is optimized for forced-air cooling (fan-driven). The spacing between the fins is engineered to balance surface area with pressure drop, ensuring that air can pass through even at lower velocities. --- ## Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Routers, switches, and base station hardware. * **Power Electronics:** Cooling MOSFETs or power regulators.