The **ATS-07F-125-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are critical in cooling electronic integrated circuits (ICs) like CPUs, GPUs, or high-speed FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Fin Style** | XC-Cut (Cross-cut) | | **Dimensions** | 50mm x 50mm x 30mm | | **Thermal Resistance** | 3.91 °C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand its specific physical configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (Standard Push-Pin Heat Sink). * **F**: Fin pitch/density characteristic. * **125**: Refers to the specific footprint and height configuration. * **C2**: Color and finish (typically indicates Blue Anodized). * **R0**: RoHS compliance status (standard revision). --- ### 3. Key Electronic Cooling Features #### A. XC-Cut Fin Design Unlike straight-fin heat sinks, the **XC-Cut** features cross-cut patterns. This creates a "pin-fin" effect that allows for omnidirectional airflow. In complex electronic enclosures where air may not move in a perfectly straight line, this design maintains high efficiency. #### B. Push-Pin Attachment The component uses a standardized push-pin system with a brass or plastic pin and a compression spring. * **Benefits:** Provides consistent downward pressure on the electronic chip, which optimizes the contact between the chip surface and the heat sink. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "T766" designation indicates a pre-applied phase-change material or thermal pad on the base. This eliminates the need for manual application of thermal paste, ensuring a low-resistance path for heat to move from the silicon die to the aluminum fins. --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed network switches and routers. * **Computing:** Secondary cooling for chipsets on motherboards. * **Industrial Power:** Managing heat in motor controllers or power supplies where space is limited but airflow is present.