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  • ATS-07F-126-C2-R0

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    The **ATS-07F-126-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimension L x W** | 54.00 mm x 54.00 mm | | **Height** | 10.00 mm | | **Pitch** | 47.00 mm | | **Thermal Resistance** | 5.47 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This heat sink features a **Fine Pitch** pattern, which is optimized for systems with high-speed airflow. * **Finned Design:** It utilizes a "Fine-Pitch" rectangular fin pattern. This maximizes surface area for heat dissipation while maintaining a low profile (10mm). * **Attachment Mechanism:** It uses the **pushPIN™** system, which consists of a brass pin and a stainless steel spring. This ensures consistent pressure across the component for optimal thermal transfer. * **Pre-applied TIM:** The base comes with **T766** thermal interface material, eliminating the need for manual thermal paste application during assembly. --- ### 3. Thermal Performance (Estimated) The efficiency of the heat sink depends on the velocity of the airflow (LFM - Linear Feet per Minute). | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 5.47 | 2.49 | 1.83 | --- ### 4. Application Use Cases The ATS-07F-126-C2-R0 is typically used in the following scenarios: 1. **Networking Hardware:** Switches and routers where vertical space is limited. 2. **Embedded Systems:** Industrial PCs that require reliable mechanical mounting. 3. **Power Electronics:** Cooling MOSFETs or small-form-factor power supplies.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for ATS heat sinks?
    • ⤷ How does the T766 thermal interface material compare to T412?
    • ⤷ Can this heat sink be used in a passive cooling environment?