ATS-07F-126-C2-R0
AI

The **ATS-07F-126-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Dimension L x W** | 54.00 mm x 54.00 mm |
| **Height** | 10.00 mm |
| **Pitch** | 47.00 mm |
| **Thermal Resistance** | 5.47 °C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design Characteristics
This heat sink features a **Fine Pitch** pattern, which is optimized for systems with high-speed airflow.
* **Finned Design:** It utilizes a "Fine-Pitch" rectangular fin pattern. This maximizes surface area for heat dissipation while maintaining a low profile (10mm).
* **Attachment Mechanism:** It uses the **pushPIN™** system, which consists of a brass pin and a stainless steel spring. This ensures consistent pressure across the component for optimal thermal transfer.
* **Pre-applied TIM:** The base comes with **T766** thermal interface material, eliminating the need for manual thermal paste application during assembly.
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### 3. Thermal Performance (Estimated)
The efficiency of the heat sink depends on the velocity of the airflow (LFM - Linear Feet per Minute).
| Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) |
| :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 5.47 | 2.49 | 1.83 |
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### 4. Application Use Cases
The ATS-07F-126-C2-R0 is typically used in the following scenarios:
1. **Networking Hardware:** Switches and routers where vertical space is limited.
2. **Embedded Systems:** Industrial PCs that require reliable mechanical mounting.
3. **Power Electronics:** Cooling MOSFETs or small-form-factor power supplies.
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What are the alternative attachment methods for ATS heat sinks?
- ⤷ How does the T766 thermal interface material compare to T412?
- ⤷ Can this heat sink be used in a passive cooling environment?