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  • ATS-07F-132-C2-R0

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    The **ATS-07F-132-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table breaks down the core physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (spring-loaded) | | **Thermal Resistance** | 2.66°C/W (undirected flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 25.00mm | --- ### Key Electronic & Design Components #### 1. Heat Sink Design (Cross-Cut) The "F" in the part number indicates a **fine-pitch** or specific fin orientation. The fins increase the surface area available for heat exchange. Because it is cross-cut, it allows for airflow from multiple directions, making it more versatile in compact electronic enclosures. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. * **Reliability:** Provides consistent pressure (TIM compression) across the component. * **Ease of Maintenance:** Can be removed and re-installed without damaging the PCB. #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766** thermal phase-change material or a high-performance grease. This fills the microscopic air gaps between the heat sink base and the electronic component (die), significantly reducing thermal resistance. #### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Not only aesthetic but also provides corrosion resistance and slightly improves emissivity (radiant heat transfer). --- ### Typical Applications This specific heat sink is commonly found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial Computing:** Embedded systems that run in high-temperature environments. * **Power Electronics:** Voltage regulators or power modules that generate significant localized heat. ---
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 2.66°C/W thermal resistance rating?
    • ⤷ How do I choose the correct push-pin length for my PCB thickness?
    • ⤷ Can this heat sink be used with active cooling fans?