ATS-07F-132-C2-R0
AI

The **ATS-07F-132-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The following table breaks down the core physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-Pin (spring-loaded) |
| **Thermal Resistance** | 2.66°C/W (undirected flow @ 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 54.00mm x 54.00mm |
| **Height** | 25.00mm |
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### Key Electronic & Design Components
#### 1. Heat Sink Design (Cross-Cut)
The "F" in the part number indicates a **fine-pitch** or specific fin orientation. The fins increase the surface area available for heat exchange. Because it is cross-cut, it allows for airflow from multiple directions, making it more versatile in compact electronic enclosures.
#### 2. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system.
* **Reliability:** Provides consistent pressure (TIM compression) across the component.
* **Ease of Maintenance:** Can be removed and re-installed without damaging the PCB.
#### 3. Thermal Interface Material (TIM)
The part comes pre-applied with **T766** thermal phase-change material or a high-performance grease. This fills the microscopic air gaps between the heat sink base and the electronic component (die), significantly reducing thermal resistance.
#### 4. Material and Finish
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** Not only aesthetic but also provides corrosion resistance and slightly improves emissivity (radiant heat transfer).
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### Typical Applications
This specific heat sink is commonly found in:
* **Networking Equipment:** High-speed routers and switches.
* **Industrial Computing:** Embedded systems that run in high-temperature environments.
* **Power Electronics:** Voltage regulators or power modules that generate significant localized heat.
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- ⤷
What is the significance of the 2.66°C/W thermal resistance rating?
- ⤷ How do I choose the correct push-pin length for my PCB thickness?
- ⤷ Can this heat sink be used with active cooling fans?