The **ATS-07F-134-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an "electronic" component in the sense of a semiconductor, it is a critical mechanical part used in electronic assemblies for thermal management. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 70mm x 70mm | | **Height** | 12.7mm | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | ~4.44 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design and Construction The design focuses on maximizing surface area while maintaining a low profile for space-constrained PCB environments. * **Cross-Cut Fin Pattern:** The fins are not continuous rows; they are cut into square pins. This allows for multidirectional airflow, meaning the cooling efficiency is less dependent on the orientation of the fan relative to the heat sink. * **pushPIN™ Attachment:** It utilizes a spring-loaded push-pin mechanism. This ensures consistent pressure between the heat sink and the electronic component (like a CPU or FPGA), which is vital for effective heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** Most parts in this series come with a pre-applied phase-change material or thermal tape to reduce thermal resistance at the contact point. --- ### 3. Application Use Cases The ATS-07F-134-C2-R0 is typically used on large surface-area components that generate significant heat but have limited vertical clearance. * **Networking Hardware:** Switches and routers where horizontal space is plentiful but height is restricted. * **Industrial Power Supplies:** Cooling power MOSFETs or large integrated circuits. * **Embedded Systems:** High-performance computing modules that require passive or active airflow cooling. --- ### 4. Thermal Performance Overview Thermal resistance ($\theta$) measures how effectively the part moves heat away. For this model: 1. **Low Airflow (100 LFM):** ~4.44 °C/W 2. **High Airflow (700 LFM):** ~1.20 °C/W *Note: The lower the number, the better the heat dissipation.*