The **ATS-07F-140-C2-R0** is a high-performance heat sink designed by Advanced Thermal Solutions (ATS). It is part of the **blueICE™** series, specifically engineered for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07F-140-C2-R0 | | **Thermal Resistance** | 7.28°C/W (at 100 LFM) | | **Material** | Aluminum | | **Fin Style** | Straight Fin (Extrusion) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 25.0mm | | **Finish** | Blue Anodized | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System The "R0" suffix refers to the specific attachment hardware. This system uses a flexible, spring-loaded mechanism that ensures: * **Constant Pressure:** Maintains optimal contact between the electronic component and the heat sink. * **Ease of Assembly:** Can be installed onto pre-drilled holes on a PCB without complex tools. #### B. Thermal Performance Electronic components generate heat as a byproduct of current flow. This heat sink is designed for **forced air** (fan) environments. * **Thermal Resistance:** At 100 Linear Feet per Minute (LFM), it provides a resistance of 7.28°C/W. As airflow increases (e.g., to 700 LFM), the resistance drops significantly, allowing for better heat dissipation in high-power circuits. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight nature. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and surface emissivity, aiding slightly in radiative cooling. --- ### 3. Application Examples This specific part is typically found in the following electronic setups: 1. **Network Switches/Routers:** Cooling small integrated circuits (ICs). 2. **Embedded Systems:** Protecting processors on industrial motherboards. 3. **Power Supplies:** Heat dissipation for high-voltage regulators or MOSFETs. ---