The **ATS-07F-141-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to ensure system stability and longevity. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 1.70°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.60°C/W @ Static | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring no interference with surrounding components. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 10.00 mm (Low profile) * **Pitch (Hole spacing):** 35.00 mm --- ### 3. Electronic Design Considerations The ATS-07F-141-C3-R0 is engineered with specific electronic constraints in mind: #### A. Fine-Pitch Fin Design The "F" in the part number indicates a **Fine-Pitch** fin pattern. This increases the surface area for heat exchange, making it ideal for high-velocity airflow environments commonly found in server racks or compact industrial computers. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical pushPIN™ system. * **Reliability:** It provides consistent pressure across the component, improving thermal transfer. * **Safety:** It prevents the heat sink from shifting or falling off due to vibration or thermal expansion/contraction. #### C. Thermal Interface Material (T412) The unit comes with **T412** pre-applied. This is a high-performance thermal grease/pad that fills microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink base, significantly reducing thermal impedance. --- ### 4. Common Applications * **Telecom/Networking:** Cooling high-speed processors in switches and routers. * **Embedded Systems:** Ideal for space-constrained industrial PC104 or SOM boards. * **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.