ATS-07F-142-C1-R0
AI

The **ATS-07F-142-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, specifically designed for high-efficiency cooling in constrained environments.
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## 1. Core Specifications
Below are the primary technical parameters for this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Dimensions** | 30.00 x 30.00 x 12.70 mm |
| **Thermal Resistance** | 11.76 °C/W (@ 100 LFM) |
| **Flow Direction** | Directional (High-Efficiency Fin Pattern) |
| **Compliance** | RoHS-6 and REACH Compliant |
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## 2. Key Electronic & Mechanical Features
### A. maxiFLOW™ Fin Geometry
The "F" in the part number indicates the maxiFLOW™ design. Unlike standard rectangular fins, these have a unique flared profile. This increases the surface area for heat dissipation while reducing the pressure drop, allowing air to flow more easily through the sink even at lower fan speeds.
### B. pushPIN™ Attachment System
The **-R0** suffix denotes the attachment hardware. This system includes:
- **Brass components:** High durability for long-term use.
- **Pre-drilled holes:** The heat sink is designed to be mounted directly to the PCB through specific hole patterns.
- **Compression Springs:** Provides precise, consistent pressure on the heat-generating component (CPU, GPU, or FPGA) to ensure maximum thermal interface contact.
### C. Thermal Performance (Airflow)
Thermal resistance varies based on the Air Velocity (LFM - Linear Feet per Minute):
| Velocity (LFM) | Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 11.76 |
| 300 (1.5 m/s) | 5.87 |
| 500 (2.5 m/s) | 4.63 |
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## 3. Typical Applications
This part is commonly used in electronic assemblies where space is limited but heat generation is high:
* **Network Switches/Routers:** For cooling ASICs.
* **Embedded Systems:** Industrial PCs with small form factors.
* **Power Supplies:** Cooling MOSFETs or power transistors.
* **LED Lighting:** High-output thermal management.
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## 4. Part Number Breakdown
`ATS - 07 F - 142 - C1 - R0`
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **07:** Series number.
* **F:** Fin style (maxiFLOW).
* **142:** Specific internal dimension code.
* **C1:** Thermal Interface Material (TIM) — Usually indicates a pre-applied high-performance thermal pad or grease.
* **R0:** Revision/Hardware kit (pushPIN attachment).
- ⤷
What is the exact hole pattern required on the PCB for the pushPIN attachment?
- ⤷ Which thermal interface material (TIM) is pre-applied to the C1 version?
- ⤷ How does the pressure drop of the maxiFLOW design compare to standard cross-cut heat sinks?