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  • ATS-07F-142-C1-R0

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    The **ATS-07F-142-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, specifically designed for high-efficiency cooling in constrained environments. --- ## 1. Core Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 30.00 x 30.00 x 12.70 mm | | **Thermal Resistance** | 11.76 °C/W (@ 100 LFM) | | **Flow Direction** | Directional (High-Efficiency Fin Pattern) | | **Compliance** | RoHS-6 and REACH Compliant | --- ## 2. Key Electronic & Mechanical Features ### A. maxiFLOW™ Fin Geometry The "F" in the part number indicates the maxiFLOW™ design. Unlike standard rectangular fins, these have a unique flared profile. This increases the surface area for heat dissipation while reducing the pressure drop, allowing air to flow more easily through the sink even at lower fan speeds. ### B. pushPIN™ Attachment System The **-R0** suffix denotes the attachment hardware. This system includes: - **Brass components:** High durability for long-term use. - **Pre-drilled holes:** The heat sink is designed to be mounted directly to the PCB through specific hole patterns. - **Compression Springs:** Provides precise, consistent pressure on the heat-generating component (CPU, GPU, or FPGA) to ensure maximum thermal interface contact. ### C. Thermal Performance (Airflow) Thermal resistance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Velocity (LFM) | Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.76 | | 300 (1.5 m/s) | 5.87 | | 500 (2.5 m/s) | 4.63 | --- ## 3. Typical Applications This part is commonly used in electronic assemblies where space is limited but heat generation is high: * **Network Switches/Routers:** For cooling ASICs. * **Embedded Systems:** Industrial PCs with small form factors. * **Power Supplies:** Cooling MOSFETs or power transistors. * **LED Lighting:** High-output thermal management. --- ## 4. Part Number Breakdown `ATS - 07 F - 142 - C1 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Series number. * **F:** Fin style (maxiFLOW). * **142:** Specific internal dimension code. * **C1:** Thermal Interface Material (TIM) — Usually indicates a pre-applied high-performance thermal pad or grease. * **R0:** Revision/Hardware kit (pushPIN attachment).
    ✨ Follow-up Questions
    • ⤷ What is the exact hole pattern required on the PCB for the pushPIN attachment?
    • ⤷ Which thermal interface material (TIM) is pre-applied to the C1 version?
    • ⤷ How does the pressure drop of the maxiFLOW design compare to standard cross-cut heat sinks?