The part number **ATS-07F-143-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This specific component is part of their "push pin" attachment series, designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Thermal Resistance** | 7.33°C/W (at 100 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Part Number Breakdown Understanding the nomenclature helps identify the specific features of the cooling solution: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (typically relates to the attachment mechanism or height profile). * **F**: Fin type or spacing configuration. * **143**: Specific size code (30mm x 30mm footprint). * **C2**: Material/Finish code (Blue Anodized Aluminum). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic Functions While a heat sink is a mechanical part, it is critical for the reliable operation of electronics: 1. **Thermal Dissipation**: It increases the surface area of the heat-generating component, allowing air to carry away heat more efficiently. 2. **Thermal Interface Material (TIM)**: The "T766" coating ensures that microscopic air gaps between the semiconductor and the heat sink are filled, reducing thermal resistance. 3. **Stability**: The push-pin mechanism provides consistent pressure across the chip, which prevents the heat sink from shifting during vibration or thermal expansion. --- ### 4. Implementation Requirements To use this part in a PCB design, the following considerations are necessary: * **Hole Pattern**: The PCB must have pre-drilled holes at specific coordinates to accommodate the 30mm x 30mm mounting pattern. * **Airflow**: This heat sink is passive; its efficiency depends on the velocity of air (measured in Linear Feet per Minute - LFM) provided by system fans. * **Clearance**: Ensure no tall components (like capacitors) are within the 30mm footprint of the fins.