The **ATS-07F-156-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is a critical passive electronic component designed to dissipate heat from semiconductors, such as CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Attachment Method** | Plastic Push Pins & Springs | | **Thermal Resistance** | 4.14°C/W (at 100 LFM) | | **Base Dimensions** | 40.00mm x 40.00mm | | **Height (Fin)** | 25.00mm | | **Flow Direction** | XC (Cross-Cut) / Omnidirectional | --- ### 2. Design and Construction * **Fin Style:** It features a **Straight-Fin** design with a cross-cut pattern. This allows for multi-directional airflow, making it versatile for different chassis layouts. * **Material:** Made from high-grade aluminum for lightweight efficiency and excellent thermal conductivity. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or similar high-performance grease to ensure minimal thermal resistance between the component and the sink. --- ### 3. The pushPIN™ Attachment System The "R0" at the end of the part number signifies the attachment system. This is an engineered mechanical solution that includes: 1. **Compression Springs:** Provide precise pressure to the processor, preventing damage while ensuring maximum contact. 2. **Plastic Pins:** Quickly snap into pre-drilled holes on the PCB (Printed Circuit Board). 3. **Reliability:** Unlike adhesive tapes, this mechanical bond is vibration-resistant and allows for easy removal/re-application during maintenance. --- ### 4. Application Use Cases This heat sink is commonly found in: * **Telecommunications:** Cooling ASICs in networking switches and routers. * **Industrial Automation:** Dissipating heat from motor controllers and PLCs. * **Computing:** Secondary cooling for chipsets or high-speed memory modules on motherboards.