The **ATS-07F-160-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications This part is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.67°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Features and Design #### A. Fin Design: XCUT The "07F" in the part number indicates a specific fin pattern. These are **straight-fin** designs modified with cross-cuts. This allows for: * Multi-directional airflow. * Increased surface area without significantly increasing the footprint. * Better performance in constrained spaces where air may not flow in a single linear path. #### B. Push-Pin Attachment Instead of using messy thermal epoxy or unreliable tape, this model uses a **spring-loaded push-pin** system. * **Reliability:** Provides consistent pressure on the component for optimal heat transfer. * **Ease of Install:** Requires pre-drilled holes in the PCB. The springs ensure the heat sink stays flush against the chip even during vibration. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the component and the heat sink base, significantly lowering thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Part of the specific family series. * **F:** Fin design type (XCUT). * **160:** Dimensions/Model code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. --- ### 4. Applications This specific heat sink is typically found in: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Embedded systems requiring passive or active cooling. * **Power Electronics:** Cooling MOSFETs or small power modules.