The **ATS-07F-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power modules to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 2.41 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 6.62 °C/W | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height (Height Off Base)** | 33.00mm | | **Pitch** | Fine Pitch | --- ## 2. Key Design Features ### pushPIN™ Attachment System Unlike standard adhesive tapes, this part uses the **pushPIN™** system. * **Secure Fit:** Uses a spring-loaded mechanism to ensure consistent pressure across the component surface, maximizing heat transfer. * **Versatility:** Comes with pre-drilled holes to accommodate different PCB thicknesses. ### Fin Design (XC High-Flow) * The heat sink features a **straight fin** or **cross-cut** design tailored for high-flow environments. * **Thermal Performance:** The "Fine Pitch" fin density is optimized for systems with active airflow (fans), allowing for a high surface-area-to-volume ratio. ### Material & Coating * **Aluminum Construction:** Offers a balance between lightweight design and high thermal conductivity. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative heat transfer. It also acts as an electrical insulator for the surface of the sink. --- ## 3. Application Use Cases This specific model is commonly used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial Controls:** Power supplies and motor drivers. 3. **Computing:** Chipsets on motherboards or embedded systems that generate significant localized heat. --- ## 4. Thermal Resistance Reference Thermal performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.41 | | 300 (1.5 m/s) | 1.34 | | 500 (2.5 m/s) | 1.08 | | 700 (3.5 m/s) | 0.94 |