The **ATS-07F-169-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 15.71°C/W (at 100 LFM) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 10.00mm | | **Fin Style** | Fine Pitch (Straight Fins) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System This model uses a specialized push-pin system. Instead of using messy adhesives or thermal tape, it utilizes a mechanical pin and spring mechanism. - **Benefit:** Ensures consistent downward pressure on the electronic chip, which optimizes thermal contact and improves heat transfer efficiency. #### B. Material and Coating - **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides corrosion resistance and slightly improves radiant heat emissivity. #### C. Thermal Performance (LFM) The efficiency of this heat sink is highly dependent on airflow (Linear Feet per Minute - LFM). - At **100 LFM** (low airflow), the thermal resistance is **15.71°C/W**. - At **700 LFM** (high airflow), the resistance drops significantly to **3.35°C/W**, making it much more effective in high-speed fan environments. --- ### 3. Application Use Cases This specific part is generally used in compact electronic environments where space is limited but heat output is moderate: * **Networking Equipment:** Routers, switches, and modems. * **Embedded Systems:** Industrial PC components. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **LED Cooling:** High-output LED arrays that require consistent thermal regulation. --- ### 4. Part Number Breakdown The nomenclature **ATS-07F-169-C2-R0** provides specific info: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Series/Design ID. * **F:** Fin pitch/style. * **169:** Specific dimensional/performance configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.