The **ATS-07F-175-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | ATS | | **Fin Type** | xcuit (Cross-Cut) | Enhanced airflow turbulence | | **Material** | Aluminum | Lightweight and good conductivity | | **Dimensions** | 35mm x 35mm x 10mm | Small form factor | | **Attachment Method** | pushPIN™ | Spring-loaded mounting for consistent pressure | | **Thermal Resistance** | 13.60°C/W (Unducted) | Performance at natural convection | | **Interface Material** | T412 | Pre-applied Thermal Interface Material (TIM) | --- ### 2. Key Features * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures the heat sink is pressed against the component with the precise amount of force required for optimal heat transfer. * **Cross-Cut Fin Design:** Unlike straight-line fins, the cross-cut pattern allows air to enter from multiple directions, making it more efficient in systems where airflow direction might be inconsistent. * **T412 Thermal Interface:** The "C3" in the part number indicates it comes with a high-performance thermal pad/grease pre-applied, which fills microscopic air gaps between the heat sink and the chip. * **Blue Anodized Finish:** The "R0" suffix typically denotes the finish and compliance; the blue anodizing protects against corrosion and increases surface emissivity. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Embedded Systems:** Industrial PCs where space is limited (10mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Mounting Diagram Logic ```markdown [ Component ] <--- [ T412 TIM ] <--- [ Heat Sink Base ] <--- [ pushPIN Springs ] ```