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  • ATS-07F-182-C1-R0

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    The **ATS-07F-182-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 7.48°C/W (@ 100 LFM) | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. Fin Geometry The "F" in the part number indicates a **fine-pitch** straight-fin design. This increases the total surface area, allowing for better heat dissipation in forced-air environments (systems with fans). ### B. Attachment Mechanism It utilizes a **push-pin and spring** assembly. - **Springs:** Provide "firm" and consistent pressure to ensure maximum contact between the heat sink and the chip. - **Push-Pins:** Usually made of nylon or plastic, designed to fit into pre-drilled holes on a PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) The unit comes with **T766** thermal grease or pad pre-applied to the base. This eliminates the need for manual application and ensures there are no air gaps between the component and the heat sink. --- ## 3. Thermal Performance Overview Thermal resistance determines how effectively the part moves heat away from the electronics. Performance varies based on airflow: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 7.48 | | 300 (Medium) | 3.68 | | 500 (High) | 2.84 | --- ### Summary of Use Case This part is typically used in **embedded systems, networking equipment, and telecommunications** where vertical space is limited (15mm height) but high thermal conductivity is required to prevent component throttling or failure.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the ATS-07F-182-C1-R0 push-pins?
    • ⤷ Is this heat sink compatible with passive cooling (no fan)?
    • ⤷ What are the alternatives if I need a lower thermal resistance in the same footprint?