ATS-07F-182-C1-R0
AI

The **ATS-07F-182-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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## 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Thermal Resistance** | 7.48°C/W (@ 100 LFM) |
| **Fin Type** | Fine Pitch (Straight Fin) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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## 2. Key Component Features
### A. Fin Geometry
The "F" in the part number indicates a **fine-pitch** straight-fin design. This increases the total surface area, allowing for better heat dissipation in forced-air environments (systems with fans).
### B. Attachment Mechanism
It utilizes a **push-pin and spring** assembly.
- **Springs:** Provide "firm" and consistent pressure to ensure maximum contact between the heat sink and the chip.
- **Push-Pins:** Usually made of nylon or plastic, designed to fit into pre-drilled holes on a PCB (Printed Circuit Board).
### C. Thermal Interface Material (TIM)
The unit comes with **T766** thermal grease or pad pre-applied to the base. This eliminates the need for manual application and ensures there are no air gaps between the component and the heat sink.
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## 3. Thermal Performance Overview
Thermal resistance determines how effectively the part moves heat away from the electronics. Performance varies based on airflow:
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Low) | 7.48 |
| 300 (Medium) | 3.68 |
| 500 (High) | 2.84 |
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### Summary of Use Case
This part is typically used in **embedded systems, networking equipment, and telecommunications** where vertical space is limited (15mm height) but high thermal conductivity is required to prevent component throttling or failure.
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What are the PCB hole requirements for the ATS-07F-182-C1-R0 push-pins?
- ⤷ Is this heat sink compatible with passive cooling (no fan)?
- ⤷ What are the alternatives if I need a lower thermal resistance in the same footprint?