ATS-07F-186-C2-R0
AI

The **ATS-07F-186-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for electronic component cooling.
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## Technical Specifications
The following table summarizes the key physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ |
| **Dimensions (L x W)** | 40.00 mm x 40.00 mm |
| **Height** | 35.00 mm |
| **Fin Style** | Fine-Pitch (Straight Fins) |
| **Thermal Resistance** | 2.80 °C/W (at 1.0 m/s airflow) |
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## Key Components and Design Features
### 1. Attachment Mechanism (pushPIN™)
The "pushPIN™" system is a specific electronic fastening method that uses a flexible spring and a plastic pin.
* **Ease of Assembly:** It allows for quick installation to a PCB without the need for tools.
* **Compression:** The spring provides consistent pressure across the interface to ensure maximum heat transfer.
### 2. Thermal Interface Material (TIM)
The "R0" suffix usually indicates the inclusion of a pre-applied thermal interface material.
* **Standard Material:** This model typically comes with **T412** phase-change material or a high-performance thermal pad.
* **Function:** It fills microscopic gaps between the heat sink base and the electronic component (CPU, GPU, or ASIC) to eliminate air pockets.
### 3. Fin Geometry
* **High-Density Design:** The "Fine-Pitch" fin arrangement maximizes surface area within a compact 40x40mm footprint.
* **Airflow Optimization:** Designed specifically for forced air (fan-cooled) environments rather than natural convection.
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## Applications
This specific heat sink is commonly used for:
* **BGA Components:** Cooling Ball Grid Array processors.
* **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
* **Industrial Computing:** Use in small form factor embedded systems where vertical space (35mm) is available but horizontal space is limited.
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- ⤷
What is the difference between the C1 and C2 versions of this heat sink?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?
- ⤷ What is the recommended hole diameter for the pushPIN installation on the PCB?