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  • ATS-07F-186-C2-R0

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    The **ATS-07F-186-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for electronic component cooling. --- ## Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 35.00 mm | | **Fin Style** | Fine-Pitch (Straight Fins) | | **Thermal Resistance** | 2.80 °C/W (at 1.0 m/s airflow) | --- ## Key Components and Design Features ### 1. Attachment Mechanism (pushPIN™) The "pushPIN™" system is a specific electronic fastening method that uses a flexible spring and a plastic pin. * **Ease of Assembly:** It allows for quick installation to a PCB without the need for tools. * **Compression:** The spring provides consistent pressure across the interface to ensure maximum heat transfer. ### 2. Thermal Interface Material (TIM) The "R0" suffix usually indicates the inclusion of a pre-applied thermal interface material. * **Standard Material:** This model typically comes with **T412** phase-change material or a high-performance thermal pad. * **Function:** It fills microscopic gaps between the heat sink base and the electronic component (CPU, GPU, or ASIC) to eliminate air pockets. ### 3. Fin Geometry * **High-Density Design:** The "Fine-Pitch" fin arrangement maximizes surface area within a compact 40x40mm footprint. * **Airflow Optimization:** Designed specifically for forced air (fan-cooled) environments rather than natural convection. --- ## Applications This specific heat sink is commonly used for: * **BGA Components:** Cooling Ball Grid Array processors. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Industrial Computing:** Use in small form factor embedded systems where vertical space (35mm) is available but horizontal space is limited. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the C1 and C2 versions of this heat sink?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?
    • ⤷ What is the recommended hole diameter for the pushPIN installation on the PCB?