ATS-07F-199-C3-R0
AI

The **ATS-07F-199-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
Below are the primary mechanical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Body), Copper (Thermal Interface) |
| **Dimensions** | 50mm x 50mm x 6mm |
| **Fin Type** | Straight Fin |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 15.95°C/W (Unducted Flow) |
| **Finish** | Blue Anodized |
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### 2. Key Electronic & Mechanical Components
#### A. The Heat Sink Body
The "F" in the part number denotes a **fine-pitch** fin structure. Because the height is very low (6mm), it is classified as a "low-profile" heat sink, making it ideal for compact electronic assemblies like 1U servers or embedded systems where vertical space is restricted.
#### B. The pushPIN™ Attachment System
Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system.
* **Springs:** Provides consistent pressure (Pre-assembled) to ensure maximum contact between the sink and the chip.
* **Compression:** Ensures the Thermal Interface Material (TIM) spreads evenly.
#### C. Thermal Interface Material (TIM)
The part comes with **T412** thermal tape or grease pre-applied. In electronics, the TIM is critical because it fills microscopic air gaps between the component (heat source) and the aluminum, significantly increasing heat transfer efficiency.
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### 3. Thermal Performance Profile
The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 15.95 |
| 400 | 2.0 | 7.72 |
| 600 | 3.0 | 5.48 |
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### 4. Part Number Breakdown (Nomenclature)
`ATS - 07 - F - 199 - C3 - R0`
* **ATS:** Manufacturer prefix.
* **07:** Series number (Push-pin style).
* **F:** Fin pitch style (Fine).
* **199:** Specific dimension and fin configuration code.
* **C3:** Material/Finish (Usually indicates Blue Anodized Aluminum).
* **R0:** Revision or packaging code.
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How do I calculate if this heat sink is sufficient for a 10W chip?
- ⤷ What are the advantages of push-pin mounting over adhesive tape?
- ⤷ Can this heat sink be used with a custom fan attachment?