Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-07F-199-C3-R0

  • AI
    The **ATS-07F-199-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Thermal Interface) | | **Dimensions** | 50mm x 50mm x 6mm | | **Fin Type** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 15.95°C/W (Unducted Flow) | | **Finish** | Blue Anodized | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body The "F" in the part number denotes a **fine-pitch** fin structure. Because the height is very low (6mm), it is classified as a "low-profile" heat sink, making it ideal for compact electronic assemblies like 1U servers or embedded systems where vertical space is restricted. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system. * **Springs:** Provides consistent pressure (Pre-assembled) to ensure maximum contact between the sink and the chip. * **Compression:** Ensures the Thermal Interface Material (TIM) spreads evenly. #### C. Thermal Interface Material (TIM) The part comes with **T412** thermal tape or grease pre-applied. In electronics, the TIM is critical because it fills microscopic air gaps between the component (heat source) and the aluminum, significantly increasing heat transfer efficiency. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 15.95 | | 400 | 2.0 | 7.72 | | 600 | 3.0 | 5.48 | --- ### 4. Part Number Breakdown (Nomenclature) `ATS - 07 - F - 199 - C3 - R0` * **ATS:** Manufacturer prefix. * **07:** Series number (Push-pin style). * **F:** Fin pitch style (Fine). * **199:** Specific dimension and fin configuration code. * **C3:** Material/Finish (Usually indicates Blue Anodized Aluminum). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?
    • ⤷ What are the advantages of push-pin mounting over adhesive tape?
    • ⤷ Can this heat sink be used with a custom fan attachment?