The **ATS-07F-200-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part is designed for cooling electronic components (like CPUs, FPGAs, or MOSFETs) by increasing the surface area available for heat dissipation. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 50mm x 50mm | | **Height (Height Off Base)** | 9.83mm | | **Thermal Resistance** | 9.90°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Key Component Breakdown #### A. Thermal Interface Material (TIM) This specific model comes pre-applied with **T412**, a high-quality thermal phase-change material. This ensures there are no air gaps between the chip and the heat sink, maximizing heat transfer. #### B. The pushPIN™ Attachment System Instead of using adhesive tape or permanent solder, this part uses a mechanical "pushPIN" system. * **Benefits:** Provides consistent pressure (force) across the component for better thermal contact. * **Reliability:** It is more vibration-resistant than adhesive methods, making it suitable for industrial or telecommunications hardware. #### C. Fin Design and Airflow The "C3" designation refers to the specific material and finish combination. The blue anodized coating is not just for aesthetics; it provides: 1. **Corrosion Resistance:** Protects the aluminum from environmental degradation. 2. **Radiative Cooling:** Slightly improves the emissivity of the surface compared to bare aluminum. --- ### 3. Applications This part is commonly found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where vertical space is limited (low profile). * **Power Supplies:** Heat dissipation for voltage regulators.