The **ATS-07F-201-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" family, designed for efficient cooling of integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-07F-201-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 50.00mm x 50.00mm x 12.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 8.17 °C/W (at 100 LFM) | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. The **Blue Anodized** finish provides surface protection against corrosion and enhances thermal radiation properties. #### B. The PushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical attachment system: * **Push Pins:** Durable brass or plastic pins that lock into the PCB. * **Compression Springs:** These provide precise, constant pressure on the electronic component (CPU/GPU/FPGA), ensuring the best possible contact for heat transfer. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit typically comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal grease, eliminating the need for separate application during assembly. --- ### 3. Performance Characteristics The efficiency of this heat sink is measured by its **Thermal Resistance**. Lower values indicate better cooling performance: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 8.17 | | 300 (1.5 m/s) | 3.56 | | 500 (2.5 m/s) | 2.56 | --- ### 4. Typical Applications * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Computing:** Secondary cooling for chipsets on motherboards. ---