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  • ATS-07F-203-C2-R0

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    The part number **ATS-07F-203-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 54mm x 54mm x 10mm | | **Fin Type** | XCUT (Straight Fin with cross-cuts) | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (Pre-applied phase change material) | | **Thermal Resistance** | 8.93 °C/W (at 200 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS-07**: Series identifier (Push-pin heat sink family). * **F**: Fin pitch/density indicator. * **203**: Specific size and height configuration (54mm x 10mm height). * **C2**: Color and finish code (typically indicates Blue Anodized finish). * **R0**: RoHS compliance status and revision level. --- ### 3. Key Electronic Cooling Features #### **A. XCUT Fin Design** The "XCUT" geometry allows for omnidirectional airflow. This is critical in electronics enclosures where the direction of the air coming from a cooling fan might not be perfectly aligned with the heat sink fins. #### **B. Mechanical Stability (Push Pins)** Unlike adhesive-based heat sinks, the push-pin mechanism provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly against the chip. * **Vibration Resistance:** Suitable for industrial or automotive electronics where physical movement might cause a glue-on heat sink to fall off. #### **C. Pre-applied TIM (T766)** The part comes with **T766 thermal grease/pad** pre-applied. This simplifies the assembly process in mass production and ensures optimal thermal conductivity between the component die and the aluminum base. --- ### 4. Common Applications * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Video Processing:** Cooling high-end DSPs or FPGAs.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole distance required on the PCB for this heat sink?
    • ⤷ How does the thermal resistance change at higher airflow rates like 400 LFM?
    • ⤷ Are there alternative spring materials available for this specific model?