ATS-07F-203-C2-R0
AI

The part number **ATS-07F-203-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 54mm x 54mm x 10mm |
| **Fin Type** | XCUT (Straight Fin with cross-cuts) |
| **Attachment Method** | Push Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface (TIM)** | T766 (Pre-applied phase change material) |
| **Thermal Resistance** | 8.93 °C/W (at 200 LFM) |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
* **ATS-07**: Series identifier (Push-pin heat sink family).
* **F**: Fin pitch/density indicator.
* **203**: Specific size and height configuration (54mm x 10mm height).
* **C2**: Color and finish code (typically indicates Blue Anodized finish).
* **R0**: RoHS compliance status and revision level.
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### 3. Key Electronic Cooling Features
#### **A. XCUT Fin Design**
The "XCUT" geometry allows for omnidirectional airflow. This is critical in electronics enclosures where the direction of the air coming from a cooling fan might not be perfectly aligned with the heat sink fins.
#### **B. Mechanical Stability (Push Pins)**
Unlike adhesive-based heat sinks, the push-pin mechanism provides:
* **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly against the chip.
* **Vibration Resistance:** Suitable for industrial or automotive electronics where physical movement might cause a glue-on heat sink to fall off.
#### **C. Pre-applied TIM (T766)**
The part comes with **T766 thermal grease/pad** pre-applied. This simplifies the assembly process in mass production and ensures optimal thermal conductivity between the component die and the aluminum base.
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### 4. Common Applications
* **Networking Gear:** Switches and routers.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or power ICs.
* **Video Processing:** Cooling high-end DSPs or FPGAs.
- ⤷
What is the hole-to-hole distance required on the PCB for this heat sink?
- ⤷ How does the thermal resistance change at higher airflow rates like 400 LFM?
- ⤷ Are there alternative spring materials available for this specific model?