The part number **ATS-07F-208-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment line, specifically designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | | **Dimensions (L x W x H)** | 70mm x 70mm x 6mm | | **Fin Style** | XC-Cut (Cross-cut) | --- ## 2. Key Design Components ### A. XC-Cut Fin Geometry The "XC-Cut" refers to the cross-cut straight fin design. This pattern increases surface area and allows for **multi-directional airflow**. This is critical in cramped electronic enclosures where air may not flow in a single straight path. ### B. Push-Pin Attachment The `-R0` suffix indicates the specific mounting hardware. * **Ease of Assembly:** It uses a plastic push-pin with a brass or steel spring. * **Reliability:** The spring provides consistent pressure on the component, ensuring maximum contact with the Thermal Interface Material (TIM) and preventing damage from vibration. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures an even, thin layer for optimal heat transfer from the chip to the aluminum sink. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **07F** | Series/Specific Design Profile | | **208** | Dimensions and Fin Configuration code | | **C2** | Material/Finish (Aluminum / Blue Anodized) | | **R0** | Revision/Hardware Kit (Standard Push-Pin/Spring) | --- ## 4. Usage Considerations * **Component Size:** Best suited for 70mm x 70mm surface area chips. * **Height Profile:** At only 6mm tall, this is a **low-profile** heat sink, ideal for 1U servers, blade modules, or slim embedded devices. * **PCB Holes:** To use this part, your Printed Circuit Board (PCB) must have pre-drilled holes matching the push-pin spacing (typically 63mm for this size). ---