The **ATS-07F-21-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. ### 1. General Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). It is designed for easy installation and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-07F-21-C2-R0 | | **Type** | Board Level, Rigid | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.33°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance. | Dimension | Value | | :--- | :--- | | **Length** | 60.00 mm | | **Width** | 60.00 mm | | **Height (Fin Height)** | 10.00 mm | | **Pitch** | Fine-Pitch | | **Hole Pattern** | Square (Standard) | --- ### 3. Key Electronic/Thermal Features #### A. Fin Design * **Pattern:** This model features a **Straight Fin** or **Cross-Cut** design (depending on the specific sub-series revision), optimized for high-surface-area contact with moving air. * **Efficiency:** The low profile (10mm) makes it ideal for dense server environments or small form-factor devices where vertical space is limited. #### B. Attachment Mechanism (pushPIN™) * **Springs:** Uses a brass or steel spring mechanism to provide consistent pressure (TIM - Thermal Interface Material compression). * **Reliability:** The push-pin design ensures the heatsink remains securely attached even under high-vibration conditions. #### C. Thermal Interface Material (TIM) * The "C2" in the part number usually indicates that the heatsink comes pre-applied with **T766** high-performance thermal grease or a similar phase-change material to ensure low thermal resistance between the component and the heatsink. --- ### 4. Application Use Cases This part is commonly found in: 1. **Telecommunications:** Cooling FPGA and ASIC chips in routers/switches. 2. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. 3. **Industrial PC:** Cooling processors in fanless or low-airflow enclosures.