The **ATS-07F-23-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *pushPIN™* series designed for Cooling Electronic Components on PCBs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic/Brass pins with Springs) | | **Fin Type** | Cross-Cut (Miniature Fin design) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 12.06 °C/W @ 100 LFM | | **Thermal Interface Material** | T412 (High performance) | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Cross-Cut) The "F" in the part number indicates a **Cross-Cut** fin design. Unlike straight-fin heat sinks, cross-cut designs allow air to flow in multiple directions. This is ideal for systems where the airflow direction is unpredictable or limited. ### B. Attachment Mechanism (pushPIN™) The part utilizes the **pushPIN™** system, which offers several advantages for electronic assembly: * **Constant Pressure:** The pre-installed springs ensure a consistent downward force on the component (CPU, GPU, or FPGA), maximizing heat transfer through the Thermal Interface Material (TIM). * **Easy Installation:** Features flexible nylon or brass pins that "click" into 3.00mm holes on the PCB. * **Secure Fit:** Prevents the heat sink from shifting during shipping or high-vibration environments. ### C. Thermal Interface Material (T412) The unit comes pre-applied with **T412 thermal tape**. This eliminates the need for manual application of thermal grease, ensuring a uniform layer that bridges the microscopic air gaps between the component and the aluminum base. --- ### 3. Typical Applications The ATS-07F-23-C3-R0 is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs and power modules. 4. **Computing:** Cooling chipsets on motherboards or high-performance GPUs.