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  • ATS-07F-26-C3-R0

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    The **ATS-07F-26-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Type** | Push-Pin Heat Sink (top mount) | | **Dimensions** | 70mm x 70mm x 10mm | | **Fin Pattern** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.28°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T412 (applied) | --- ### 2. Key Features and Design #### A. Attachment Mechanism (Push-Pins) The "F" in the part number indicates the specific attachment style. It uses **brass push-pins** with a compression spring. This provides: * **Constant Pressure:** Ensures the heat sink stays firmly against the component, improving heat transfer. * **Ease of Installation:** No specialized tools are required for mounting to a PCB with pre-drilled holes. #### B. Low Profile Design With a height of only **10mm**, this heat sink is designed for "Low Profile" applications where vertical space is limited, such as in 1U servers, thin clients, or embedded systems. #### C. Material and Coating * **Aluminum:** Chosen for its excellent weight-to-thermal-conductivity ratio. * **Blue Anodizing:** Besides aesthetics, the anodized layer provides electrical insulation and improves corrosion resistance. --- ### 3. Thermal Performance Profile Thermal resistance is dependent on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 14.28 | | 200 (Forced) | 6.91 | | 300 (Forced) | 4.60 | | 500 (Forced) | 2.80 | --- ### 4. Part Number Breakdown The naming convention follows the ATS standard: * **ATS**: Advanced Thermal Solutions. * **07**: Series identifier. * **F**: Fastener type (Push-pin). * **26**: Specific dimensional footprint. * **C3**: Material/Finish code (Blue Anodized). * **R0**: Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the recommended PCB hole sizes for the push-pin mounting of this heat sink?
    • ⤷ Can this heat sink be used without a fan (passive cooling)?
    • ⤷ How does the T412 thermal interface material compare to high-performance thermal paste?