ATS-07F-26-C3-R0
AI

The **ATS-07F-26-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Type** | Push-Pin Heat Sink (top mount) |
| **Dimensions** | 70mm x 70mm x 10mm |
| **Fin Pattern** | Straight Fin |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 14.28°C/W (at 100 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T412 (applied) |
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### 2. Key Features and Design
#### A. Attachment Mechanism (Push-Pins)
The "F" in the part number indicates the specific attachment style. It uses **brass push-pins** with a compression spring. This provides:
* **Constant Pressure:** Ensures the heat sink stays firmly against the component, improving heat transfer.
* **Ease of Installation:** No specialized tools are required for mounting to a PCB with pre-drilled holes.
#### B. Low Profile Design
With a height of only **10mm**, this heat sink is designed for "Low Profile" applications where vertical space is limited, such as in 1U servers, thin clients, or embedded systems.
#### C. Material and Coating
* **Aluminum:** Chosen for its excellent weight-to-thermal-conductivity ratio.
* **Blue Anodizing:** Besides aesthetics, the anodized layer provides electrical insulation and improves corrosion resistance.
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### 3. Thermal Performance Profile
Thermal resistance is dependent on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural) | 14.28 |
| 200 (Forced) | 6.91 |
| 300 (Forced) | 4.60 |
| 500 (Forced) | 2.80 |
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### 4. Part Number Breakdown
The naming convention follows the ATS standard:
* **ATS**: Advanced Thermal Solutions.
* **07**: Series identifier.
* **F**: Fastener type (Push-pin).
* **26**: Specific dimensional footprint.
* **C3**: Material/Finish code (Blue Anodized).
* **R0**: Revision/Packaging code.
- ⤷
What are the recommended PCB hole sizes for the push-pin mounting of this heat sink?
- ⤷ Can this heat sink be used without a fan (passive cooling)?
- ⤷ How does the T412 thermal interface material compare to high-performance thermal paste?