ATS-07F-31-C3-R0
AI

The **ATS-07F-31-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components.
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Thermal Resistance** | 25.33°C/W (Unducted Flow @ 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 54.00mm x 54.00mm |
| **Height** | 10.00mm |
| **Attachment Method** | Push-Pin (Spring-loaded) |
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### 2. Design Features
The "F" in the part number denotes a **Fine-Pitch** fin design. This provides a larger surface area relative to the volume, which is critical for cooling in environments with low to medium airflow.
* **Attachment:** It uses a **Push-Pin** mounting system. This provides a secure, consistent mechanical pressure (pre-loaded springs) against the component, ensuring high thermal interface efficiency.
* **Material:** Made of high-grade aluminum for lightweight thermal conductivity.
* **Finish:** The Blue Anodized coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity.
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### 3. Application Use Cases
This specific heatsink is typically used in the following electronic applications:
1. **Networking Hardware:** Cooling CPUs or ASICs in routers and switches.
2. **Embedded Systems:** Industrial PCs where height constraints (10mm profile) are a factor.
3. **Power Electronics:** Dissipating heat from MOSFET arrays or power modules.
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### 4. Part Number Breakdown (Nomenclature)
`ATS-07F-31-C3-R0`
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **07** | Custom Series Identifier |
| **F** | Fine Pitch Fin Pattern |
| **31** | Specific Dimension/Performance Code |
| **C3** | Thermal Interface Material (T412) & Finish Code |
| **R0** | RoHS Compliant / Revision |
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What is the recommended Thermal Interface Material for this heatsink?
- ⤷ How do I calculate if the 10mm height is sufficient for my PCB enclosure?
- ⤷ Does this model support fan mounting for active cooling?