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  • ATS-07F-31-C3-R0

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    The **ATS-07F-31-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 25.33°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 10.00mm | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### 2. Design Features The "F" in the part number denotes a **Fine-Pitch** fin design. This provides a larger surface area relative to the volume, which is critical for cooling in environments with low to medium airflow. * **Attachment:** It uses a **Push-Pin** mounting system. This provides a secure, consistent mechanical pressure (pre-loaded springs) against the component, ensuring high thermal interface efficiency. * **Material:** Made of high-grade aluminum for lightweight thermal conductivity. * **Finish:** The Blue Anodized coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity. --- ### 3. Application Use Cases This specific heatsink is typically used in the following electronic applications: 1. **Networking Hardware:** Cooling CPUs or ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs where height constraints (10mm profile) are a factor. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or power modules. --- ### 4. Part Number Breakdown (Nomenclature) `ATS-07F-31-C3-R0` | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **07** | Custom Series Identifier | | **F** | Fine Pitch Fin Pattern | | **31** | Specific Dimension/Performance Code | | **C3** | Thermal Interface Material (T412) & Finish Code | | **R0** | RoHS Compliant / Revision |
    ✨ Follow-up Questions
    • ⤷ What is the recommended Thermal Interface Material for this heatsink?
    • ⤷ How do I calculate if the 10mm height is sufficient for my PCB enclosure?
    • ⤷ Does this model support fan mounting for active cooling?