The **ATS-07F-34-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimension (L x W)** | 35.00mm x 35.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight (Cross-Cut) | | **Thermal Resistance** | 6.84°C/W (at 100 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Cross-Cut) The "F" in the part number denotes a specific fin pattern. Unlike simple longitudinal fins, cross-cut fins allow for **multi-directional airflow**. This is critical in dense electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. ### B. Push-Pin Attachment Mechanism This part utilizes a pre-drilled hole mounting system: * **Ease of Assembly:** It uses a flexible plastic push-pin and a high-tension compression spring. * **Consistent Pressure:** The spring ensures that a specific amount of downward force is applied to the component, optimizing the interface between the heat sink and the chip. * **Reliability:** Unlike adhesive tapes, push pins are more resistant to vibration and thermal expansion cycles. ### C. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This fills the microscopic air gaps between the heat sink and the CPU/GPU, significantly lowering thermal resistance. --- ### 3. Applications The ATS-07F-34-C3-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling for MOSFETs or voltage regulators. 4. **Computing:** Chipset or Northbridge cooling on custom PCBs. ---