The **ATS-07F-36-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 14.90°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 36.83 mm x 36.83 mm | | **Height** | 12.70 mm | | **Fin Type** | Fine Pitch (straight fins) | --- ### 2. Key Components & Design #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this model uses a **pushPIN™** mechanism. - **Component:** It consists of a brass or plastic pin with a stainless steel spring. - **Benefit:** This ensures constant pressure (clamping force) on the electronic chip, which improves the interface between the heat sink and the component for better heat transfer. #### B. Material and Finish - **Aluminum (AL6063):** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity, aiding in radiation cooling. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **no pre-applied Thermal Interface Material (TIM)** or a specific standard configuration. Usually, users apply a high-performance thermal paste or pad between the chip and the heat sink base to fill microscopic air gaps. --- ### 3. Thermal Performance Overview Heat sinks work by increasing the surface area exposed to air. The efficiency of the ATS-07F-36-C3-R0 varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 14.90 | | 300 | 1.5 | 5.70 | | 500 | 2.5 | 3.90 | | 700 | 3.5 | 3.10 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Small routers, switches, and SFP modules. * **Power Electronics:** Voltage regulators and MOSFETs that generate significant localized heat. ---