The **ATS-07F-41-C1-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and thermal properties of the component. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 17.50mm | | **Thermal Resistance** | 10.02°C/W (Unducted Flow @ 200 LFM) | | **Fin Type** | XCUT (Cross-Cut) | | **Hardware** | ATS-HK176-R0 (Springs/Pins) | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body (Aluminum) The core of the unit is made from aluminum, chosen for its excellent thermal conductivity-to-weight ratio. The **blue anodized finish** is not just for aesthetics; it provides surface protection and slightly improves radiant heat transfer. #### B. The XCUT Fin Design This model uses a **Cross-Cut (XCUT)** fin pattern. Unlike straight fins, cross-cut fins allow for: * **Omnidirectional Airflow:** Air can enter or exit from any side, making it ideal for enclosures where airflow direction is unpredictable. * **Increased Turbulence:** It breaks up the boundary layer of air, allowing for better heat transfer between the metal and the atmosphere. #### C. push-PIN™ Attachment System The "F" in the part number often indicates the attachment style. This unit uses a standardized **push-pin and brass spring** mechanism: * **Installation:** The pins are pushed through pre-drilled holes in the PCB. * **Pressure:** The springs provide precise, consistent pressure against the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). --- ### 3. Applications This part is commonly found in industrial and consumer electronics where space is limited but heat output is moderate: 1. **Telecommunications:** For cooling signal processors. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison *At various air velocities (Linear Feet per Minute):* | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static) | 17.33 | | 300 | 7.42 | | 500 | 5.31 |