The **ATS-07F-44-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Product Type** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Type** | Fine Pitch (Rectangular) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | ~20.6°C/W (at 100 LFM) to ~2.1°C/W (at 700 LFM) | --- ### 2. Physical Design Components This component consists of several integrated parts that work together: 1. **The Heat Sink Body:** A series of vertical fins extruded from aluminum. The "Fine Pitch" design maximizes the surface area available for air-to-metal contact. 2. **Push-Pin Attachment:** Instead of using messy adhesives, this part uses plastic or brass push-pins. These provide a constant pressure (clamping force) on the electronic chip, ensuring optimal heat transfer. 3. **Springs:** The "R0" designation usually refers to a specific spring tension (often a compression spring) that prevents the heat sink from shifting during vibration or shipping. 4. **Thermal Interface Material (TIM):** Most "C3" variants come with pre-applied thermal tape or grease on the bottom surface to fill microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Analysis The efficiency of this part is measured by its **Thermal Resistance**. Lower values are better. * **Low Airflow (100 LFM):** The resistance is high (approx. 20.62 °C/W), meaning it is not very effective in passive environments. * **High Airflow (700 LFM):** With active cooling (fans), the resistance drops significantly (approx. 2.13 °C/W), making it highly effective for power-dense electronics. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. * **Small Form Factor (SFF) Electronics:** Because of its low 10mm profile.