The **ATS-07F-48-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimension (L x W)** | 30.00 mm x 30.00 mm | | **Height (Fin Height)** | 25.00 mm | | **Fin Style** | XCUT (Cross-cut / Pin Fin) | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 7.50°C/W (at 100 LFM) | --- ### 2. Part Number Breakdown The part number follows a specific nomenclature used by ATS to identify the configuration: * **ATS-07**: Series designation. * **F**: Fin pitch/density (in this case, "Fine"). * **48**: Specific size/design code within the series. * **C1**: Material and Finish (Copper/Aluminum with specific coating, typically Blue Anodized Aluminum). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic/Thermal Features #### A. XCUT Fin Design The "XCUT" geometry refers to the cross-cut pattern in the aluminum fins. Unlike standard straight-fin heat sinks, this design allows for **multi-directional airflow**. This is critical in cramped electronic enclosures where the fan placement might not align perfectly with the heat sink. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or tapes, this part uses a **pre-assembled push-pin and spring system**. * **Stability:** Provides consistent pressure across the component for better heat transfer. * **Installation:** Uses two holes drilled into the PCB (usually 3.0mm diameter). * **Serviceability:** Allows the heat sink to be removed and re-installed easily during maintenance. #### C. Thermal Interface Material (TIM) The "R0" designation typically implies that the unit comes with **pre-applied phase-change material** or a high-performance thermal pad on the base. This eliminates the need for manual application of thermal grease during the assembly of the electronic board. --- ### 4. Typical Applications * **Networking:** Switches, routers, and high-speed modems. * **Industrial PC:** Embedded controllers that require passive or semi-passive cooling. * **Power Electronics:** Voltage regulators and high-power transistors.