The **ATS-07F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin mounted series designed for cooling integrated circuits (ICs) like processors, BGA chips, and FPGAs. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Fin Type** | Fine Pitch (Rectangular) | | **Thermal Resistance** | 26.55°C/W (Unducted Flow) | | **Weight** | ~25 grams | --- ## 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCBA (Printed Circuit Board Assembly) layout. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 25.00 mm x 25.00 mm | | **Height** | 20.00 mm | | **Mounting Hole Spacing** | 30.00 mm | --- ## 3. Key Electronic Components & Features ### A. Material Composition * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just aesthetic; the coating increases surface emissivity and protects the aluminum from corrosion and electrical shorting during handling. ### B. Thermal Interface Material (TIM) * **T412 Material:** This part usually comes pre-applied with a Phase Change Material or high-performance thermal tape. This fills microscopic air gaps between the component (CPU/GPU) and the heat sink base to maximize heat transfer. ### C. Mechanical Attachment (The "Push-Pin") * Unlike adhesive-based heat sinks, this uses a **Brass Push-Pin** system. * **Benefit:** Provides consistent pressure (clamping force) on the electronic chip, which improves thermal performance and ensures the sink doesn't fall off due to vibration or high temperatures. --- ## 4. Performance Data (Airflow) The effectiveness of this part depends on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 11.93 | | 400 | 8.35 | | 600 | 7.15 | ---