The **ATS-07F-61-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 22.07 °C/W (Unducted) | | **Base Dimensions** | 45.00mm x 45.00mm | | **Height** | 10.00mm | --- ### 2. Key Features * **Fin Design:** It utilizes a **Fine Pitch** or **Straight Fin** design to maximize surface area within a low-profile (10mm) height. * **pushPIN™ Technology:** Uses a spring-loaded attachment system for consistent pressure and easy installation onto a PCB. * **High Performance:** Designed for forced-air environments (fan-cooled systems) to efficiently move heat away from the die. * **Material Choice:** Aluminum 6063 provides a good balance between thermal conductivity, weight, and corrosion resistance. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Networking Hardware:** Routers, switches, and high-speed modems. 2. **Embedded Systems:** Industrial PCs and controllers where vertical space is limited. 3. **Power Supplies:** Cooling voltage regulators and MOSFETs. 4. **Consumer Electronics:** Set-top boxes or digital signage players. --- ### 4. Thermal Performance Data Thermal resistance depends heavily on air velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.07 | | 300 (1.5 m/s) | 5.83 | | 500 (2.5 m/s) | 3.57 |