The **ATS-07F-64-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to PCBs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Type** | Push Pin (Spring loaded) | | **Thermal Resistance** | 9.36° C/W @ 100 LFM (Linear Feet per Minute) | | **Fin Style** | XCUT (Straight Fins with Cross-cut) | | **Thermal Interface** | T766 (High performance phase change material) | --- ### 2. Key Design Features #### A. XCUT Fin Profile Unlike standard straight fins, the "XCUT" design features cross-cuts. This allows the heat sink to handle **omni-directional airflow**, meaning it remains efficient even if the air is not blowing perfectly straight through the fins. #### B. Push Pin Mounting This model utilizes a push-pin attachment mechanism rather than thermal tape or clips. * **Security:** Provides consistent pressure for optimal heat transfer. * **Safety:** Prevents the heat sink from shifting or falling off during high-vibration environments. * **Ease of Install:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal grease/pad**. This ensures that microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink are filled, maximizing heat conductivity. --- ### 3. Common Applications This heat sink is typically used for medium-sized electronic components that generate significant heat: * **Network Switches & Routers:** Cooling ASICs and processing units. * **Industrial PCs:** Cooling embedded CPU modules. * **Power Supplies:** Managing thermal load on MOSFETs or power regulators. * **FPGA Cooling:** High-speed programmable logic devices. --- ### 4. Thermal Performance Data Performance varies based on airflow speed: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.36 | | 200 | 1.0 | 4.39 | | 300 | 1.5 | 3.07 | | 400 | 2.0 | 2.50 |