The **ATS-07F-69-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 11.46 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System The "R0" at the end of the part number indicates the specific attachment kit. This system uses a pre-drilled hole pattern on the PCB with a spring-loaded pin. * **Benefits:** Ensures consistent pressure (clamping force) across the thermal interface material (TIM). * **Security:** Much more reliable than adhesive tapes in high-vibration environments. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** Not just for aesthetics; it provides surface protection against corrosion and increases the emissivity of the surface, slightly improving radiation heat transfer. #### C. Fin Geometry The straight-fin design is optimized for **forced air convection**. While it works in natural convection, its efficiency peaks when paired with a system fan or directed airflow within a chassis. --- ### 3. Thermal Performance Breakdown Thermal resistance ($\theta$) is the most critical metric. Lower numbers indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.46 | | 300 (1.5 m/s) | 3.92 | | 500 (2.5 m/s) | 2.59 | | 700 (3.5 m/s) | 2.11 | --- ### 4. Typical Applications * **Networking Equipment:** Routers, switches, and base stations. * **Industrial PCs:** Cooling embedded processors in fan-less or low-airflow enclosures. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.