The **ATS-07F-77-C1-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.28°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | --- ### 2. Design and Construction #### A. Fin Profile (Straight Fin) This model uses a **straight-fin design**, which is optimized for airflow that moves linearly across the component. The vertical fins provide a large surface area to dissipate heat into the surrounding air. #### B. Material and Finish * **Aluminum:** Chosen for its excellent balance between thermal conductivity and light weight. * **Blue Anodized Finish:** Not only provides an aesthetic look but also offers corrosion resistance and slightly improves radiative heat transfer. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **pre-applied Phase Change Material** or a high-performance thermal pad (usually ATS-51), ensuring a low-resistance thermal path between the chip and the heatsink. --- ### 3. Attachment Mechanism (Push-Pin) The heatsink utilizes a **Push-Pin and Spring** assembly. * **Ease of Install:** It requires pre-drilled holes in the PCB. * **Constant Pressure:** The compression spring ensures consistent downward force, which is critical for maintaining contact between the heatsink and the electronic component to prevent overheating. --- ### 4. Performance Data (Airflow) | Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 9.28 °C/W | 4.14 °C/W | | 300 | 3.55 °C/W | 2.18 °C/W | | 500 | 2.51 °C/W | 1.64 °C/W | --- ### 5. Common Applications * **Embedded Systems:** Cooling microprocessors on compact boards. * **Telecommunications:** Networking switches and routers. * **Power Supplies:** Regulating temperature for voltage converters.