The **ATS-07F-77-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Length/Width** | 25.00mm x 25.00mm | | **Height** | 20.00mm | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 9.58°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Fin Style** | Tapered (maxiFLOW™) | | **Fin Pitch** | Coarse | --- ### 2. Key Electronic & Mechanical Design Features * **maxiFLOW™ Fin Geometry:** The tapered fin design increases the surface area while reducing pressure drop. This allows for maximum heat dissipation when used with forced air (fans). * **Thermal Interface Material (TIM):** The "C3" in the part number indicates it comes pre-applied with **T766 phase-change material** or a high-performance thermal pad. This ensures minimal thermal resistance between the component surface and the heat sink. * **pushPIN™ Attachment:** This part uses a spring-loaded push-pin mechanism. This provides: 1. **Consistent Pressure:** Ensures the heat sink is pressed firmly against the chip. 2. **Vibration Resistance:** Ideal for industrial or mobile electronics. 3. **Ease of Assembly:** Quick installation via pre-drilled holes in the PCB. --- ### 3. Application Use Cases This specific model is typically used for small-form-factor electronics requiring high thermal efficiency in a compact 25mm footprint: * **Network Switches/Routers:** Cooling ASICs and high-speed processors. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. ---