The **ATS-07F-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 19.22°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | XCUT (Fine Pitch) | --- ### 2. Key Design Elements #### A. Fin Geometry: XCUT The "XCUT" (cross-cut) design provides a high surface area while allowing for multidirectional airflow. This is particularly useful in systems where air direction is not strictly linear, as it allows heat to escape even with turbulent or cross-flow air. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or simple clips, this part utilizes the **pushPIN™** system: * It features a flexible spring mechanism that provides precise pressure (7-10 lbs) on the electronic component. * This ensures optimal contact with the Thermal Interface Material (TIM). * The pins are typically made of brass or plastic with a stainless steel spring. #### C. Thermal Performance The efficiency of this heat sink is measured by **Thermal Resistance (°C/W)**. A lower number indicates better cooling. At higher airflows (e.g., 500 LFM), the resistance drops significantly (to roughly 4.02°C/W), making it highly effective for active cooling environments. --- ### 3. Application Examples This specific heat sink is typically found in: * **Networking Equipment:** Routers and switches with high-speed processors. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Telecommunications:** Base stations and signal processing units. --- ### 4. Thermal Comparison *Values are approximate based on airflow speed.* | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 19.22 | | 300 | 1.5 | 5.92 | | 500 | 2.5 | 4.02 | | 700 | 3.5 | 3.35 |