The **ATS-07F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Fin Pitch** | Coarse Pitch | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 10.97 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS: - **ATS**: Advanced Thermal Solutions. - **07**: Series designation (pushPIN™). - **F**: Fin style (Straight Fin). - **82**: Specific footprint/size identifier. - **C3**: Thermal performance/Material grade. - **R0**: Revision/Packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), it serves critical functions in an electronic system: * **Thermal Dissipation:** It increases the surface area of a heat-generating component, allowing heat to transfer more efficiently to the surrounding air. * **Thermal Interface Material (TIM):** The **T412** material pre-applied to the base fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. * **Mechanical Stability:** The **pushPIN™** system uses a brass pin and a stainless steel spring. This provides a precise "clamping force" that ensures consistent contact between the sink and the chip without damaging the PCB. --- ### 4. Comparison of Airflow Performance Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.97 | | 300 (1.5 m/s) | 4.60 | | 500 (2.5 m/s) | 3.35 | | 700 (3.5 m/s) | 2.85 |