The **ATS-07F-86-C1-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series designed for high-performance cooling of integrated circuits (ICs). --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (typically 6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 15mm | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~3.0°C/W (at 200 LFM) | --- ## 2. Key Features * **XC (Extra Coarse) Fin Design:** The "86" series typically features a straight-fin design that provides a large surface area for heat dissipation while maintaining a low pressure drop. * **Push Pin Attachment:** It utilizes a tool-free mounting system. The plastic push pins expand into pre-drilled holes on the PCB (Printed Circuit Board), while a spring provides the necessary downward pressure for thermal contact. * **Pre-applied Thermal Interface Material (TIM):** Most "C1" variants come with a pre-applied high-performance thermal pad or grease (such as Phase Change Material) on the base. --- ## 3. Applications This part is commonly used in the following electronic environments: 1. **Networking Hardware:** Switches, routers, and high-speed modems. 2. **Industrial Computing:** Embedded systems where airflows are controlled. 3. **Power Supplies:** Cooling voltage regulators or power transistors. 4. **Processors:** Cooling small CPUs, FPGAs, or ASICs on densely packed boards. --- ## 4. Visual/Mechanical Diagram ```text [ FINS ] <-- Heat Dissipation Area ============== [ BASE PLATE ] <-- Contacts the IC | | [PIN] [PIN] <-- Push pins lock into PCB holes ```