The **ATS-07F-92-C1-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of high-performance heat sinks. --- ## 1. Technical Specifications The following table outlines the mechanical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 16.40 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Finish** | Blue Anodized | --- ## 2. Key Component Details ### A. Material and Design * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Straight Fin Geometry:** This design is optimized for environments where there is a consistent flow of air (forced convection). The spacing between fins allows air to pass through and carry away heat efficiently. ### B. The pushPIN™ Attachment System One of the most critical aspects of this part is the mounting hardware: * **Brass Components:** The pins are typically made of brass with a high-performance compression spring. * **Pre-drilled Holes:** It requires specific PCB holes (usually 3.0mm diameter) for secure mounting. * **Consistent Pressure:** The spring ensures a constant pressure is applied between the heat sink and the electronic component (CPU/GPU/FPGA), maximizing thermal transfer. ### C. Thermal Interface Material (TIM) * The part usually comes pre-applied with **Phase Change Material (PCM)** or high-performance thermal grease on the base. This fills microscopic air gaps between the heat sink and the chip. --- ## 3. Application Use Cases This specific heat sink is typically used for cooling: 1. **High-Speed Processors:** Small form factor CPUs or Microcontrollers. 2. **FPGAs & ASICs:** Integrated circuits that generate moderate heat in telecommunications. 3. **Power Supplies:** Regulating heat in DC-DC converters. ---