The **ATS-07G-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Resistance** | ~4.84 °C/W (at 100 LFM) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System The "R0" suffix often indicates the use of the ATS pushPIN™ mounting system. This system includes: * **Pre-assembled Springs:** Ensures precise pressure (load) is applied to the component for maximum heat transfer. * **Compression Springs:** Provides 20 different spring force options to meet specific design requirements. * **Plastic/Brass Pins:** Simplifies installation through pre-drilled holes in the PCB. #### B. Thermal Interface Material (TIM) This specific part usually comes with **pre-applied Thermal Interface Material** on the base. This eliminates the need for manual thermal paste application and ensures a consistent, thin layer for minimal thermal impedance between the chip and the heat sink. #### C. Fin Design The heat sink utilizes a **straight fin** geometry. This design is optimized for "longitudinal" airflow, making it highly efficient in environments where there is a clear directional path for the cooling fans. --- ### 3. Application Use Cases The ATS-07G-100-C2-R0 is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial motherboards and controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Computing:** Secondary chipsets or localized hot spots on a PCB. --- ### 4. Thermal Performance Overview * **At 100 LFM (Linear Feet per Minute):** 4.84 °C/W (High resistance) * **At 500 LFM:** 1.49 °C/W (Low resistance) *Note: As airflow increases, the thermal resistance drops significantly, allowing the component to stay cooler under high workloads.*