The **ATS-07G-14-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 20.00mm | | **Thermal Resistance** | 9.97°C/W (Unducted Flow @ 200 LFM) | | **Weight** | ~45 grams | --- ### 2. Key Features and Construction #### A. Heat Sink Geometry (Blue Anodized Aluminum) The "07G" series typically features a **cross-cut fin design**. This pattern creates a matrix of pins/fins that allows for high airflow efficiency. The blue anodized coating is not just aesthetic; it provides: * Increased surface emissivity for better radiation heat transfer. * Corrosion resistance for the aluminum substrate. #### B. Push-Pin Attachment Mechanism This part uses a specific mechanical mounting system: * **Push-Pins:** Plastic fasteners that snap into pre-drilled holes on the PCB. * **Springs:** The pins are equipped with compression springs to ensure constant, even pressure (TIM interface pressure) between the heat sink base and the electronic component. #### C. Thermal Interface Material (TIM) The "C2" suffix in the part number usually indicates that the heat sink comes with **pre-applied Thermal Interface Material**. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer from the chip to the aluminum base. --- ### 3. Typical Applications The ATS-07G-14-C2-R0 is commonly used in the following environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Compact motherboards where vertical space is limited to 20mm. 3. **Embedded Systems:** Systems requiring reliable mechanical mounting that can withstand vibration. ---