ATS-07G-141-C2-R0
AI

The **ATS-07G-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure.
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### 1. Key Technical Specifications
The part belongs to the **pushPIN™** series, which uses a specialized attachment mechanism.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Fin Type** | Straight |
| **Dimensions (L x W)** | 30.00 mm x 30.00 mm |
| **Height (Height off Base)** | 10.00 mm |
| **Pitch (Hole spacing)** | 35.00 mm |
| **Thermal Resistance** | 15.71°C/W (at 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
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### 2. Physical Design and Functionality
* **Fin Profile:** It utilizes a high-efficiency fin pattern designed to maximize surface area contact with the air while maintaining low pressure drop.
* **Attachment Mechanism:** The "pushPIN" system consists of a brass or plastic pin and a high-performance compression spring. This ensures even pressure across the surface of the component (like a CPU or FPGA) for optimal heat transfer.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied thermal phase-change material or grease, ensuring there are no air gaps between the heat sink and the chip.
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### 3. Thermal Performance (Air Flow)
Thermal resistance varies based on the velocity of air (measured in Linear Feet per Minute - LFM) moving through the fins:
| Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 15.71 |
| 300 | 1.5 | 8.35 |
| 500 | 2.5 | 6.67 |
| 700 | 3.5 | 5.81 |
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### 4. Common Applications
This part is commonly used in compact electronic environments where space is limited but heat density is high:
* **Networking:** Routers, switches, and gateways.
* **Embedded Systems:** Industrial PC boards and IoT controllers.
* **Power Electronics:** Voltage regulators and power converters.
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What are the advantages of pushPIN attachment over adhesive tapes?
- ⤷ How do I calculate if 15.71°C/W is sufficient for my specific IC?
- ⤷ Are there copper versions of this heat sink for higher thermal conductivity?