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  • ATS-07G-141-C2-R0

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    The **ATS-07G-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications The part belongs to the **pushPIN™** series, which uses a specialized attachment mechanism. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Height off Base)** | 10.00 mm | | **Pitch (Hole spacing)** | 35.00 mm | | **Thermal Resistance** | 15.71°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Physical Design and Functionality * **Fin Profile:** It utilizes a high-efficiency fin pattern designed to maximize surface area contact with the air while maintaining low pressure drop. * **Attachment Mechanism:** The "pushPIN" system consists of a brass or plastic pin and a high-performance compression spring. This ensures even pressure across the surface of the component (like a CPU or FPGA) for optimal heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied thermal phase-change material or grease, ensuring there are no air gaps between the heat sink and the chip. --- ### 3. Thermal Performance (Air Flow) Thermal resistance varies based on the velocity of air (measured in Linear Feet per Minute - LFM) moving through the fins: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.71 | | 300 | 1.5 | 8.35 | | 500 | 2.5 | 6.67 | | 700 | 3.5 | 5.81 | --- ### 4. Common Applications This part is commonly used in compact electronic environments where space is limited but heat density is high: * **Networking:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PC boards and IoT controllers. * **Power Electronics:** Voltage regulators and power converters.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN attachment over adhesive tapes?
    • ⤷ How do I calculate if 15.71°C/W is sufficient for my specific IC?
    • ⤷ Are there copper versions of this heat sink for higher thermal conductivity?