The **ATS-07G-162-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 3.62°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design (Cross-Cut) The "G" in the part number indicates a **fine-pitch** or **cross-cut** rectangular fin design. This increases the surface area available for heat transfer. The 25mm height is optimized for systems with moderate vertical clearance while providing high cooling capacity. #### 2. Attachment System: pushPIN™ This part utilizes a push-pin mechanism rather than adhesive. This is critical for electronics because: * **Reliability:** Provides consistent pressure (force) against the electronic component. * **Maintenance:** Allows the heat sink to be removed and reinstalled without damaging the PCB. * **Stability:** The brass or plastic pins securely lock into pre-drilled holes in the motherboard or PCB. #### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. In electronics, the TIM is vital because it fills microscopic air gaps between the component (silicon) and the heat sink base, significantly reducing thermal impedance. #### 4. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** While aluminum is conductive, the anodized layer provides a thin non-conductive surface, reducing the risk of short-circuits if the sink touches nearby components. --- ### Application in Systems This specific model is commonly used in: * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** Cooling of high-speed networking chips. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.