The **ATS-07G-172-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 30.00mm x 30.00mm | | **Height (Fin)** | 25.00mm | | **Thermal Resistance** | 5.71°C/W (@ 1.0 m/s airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Finish** | Blue Anodized | --- ### 2. Design Features #### A. Fin Pattern (Cross-Cut) The "G" in the part number often signifies a **cross-cut** or straight fin design optimized for multi-directional airflow. This allows the heat sink to perform effectively regardless of how the cooling fan is oriented relative to the component. #### B. Push-Pin Mounting The device uses a push-pin mechanism with a compression spring. This offers several advantages: * **Constant Pressure:** Ensures the thermal interface material (TIM) is evenly compressed against the chip. * **Vibration Resistance:** The spring tension prevents the heat sink from shifting during transport or mechanical stress. * **Easy Assembly:** No specialized tools are required for installation into pre-drilled PCB holes. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ### 3. Application Use Cases * **Embedded Systems:** Ideal for industrial PCs where airflow may be restricted. * **Networking Hardware:** Used on switches and routers to cool high-speed processing chips. * **Power Supplies:** Cooling MOSFETs or power regulators in compact enclosures. ---