The **ATS-07G-20-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic properties. ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-07G-20-C2-R0 | | **Product Type** | Heat Sink (Passive Cooling) | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision in sizing is critical for ensuring the heat sink fits within the allocated PCB real estate without interfering with adjacent components. * **Length:** 54.00 mm * **Width:** 40.00 mm * **Height (Fin Depth):** 25.00 mm * **Pitch (Hole-to-Hole):** 47.00 mm --- ### 3. Thermal Performance Thermal resistance is measured in **°C/W** (degrees Celsius per Watt). A lower number indicates better heat dissipation. Performance varies based on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 LFM (0.5 m/s) | 7.14 °C/W | | 200 LFM (1.0 m/s) | 2.36 °C/W | | 300 LFM (1.5 m/s) | 1.63 °C/W | | 500 LFM (2.5 m/s) | 1.24 °C/W | --- ### 4. Key Design Features * **Fin Design (XC-Cut):** The "XC-Cut" refers to the cross-cut pattern in the fins. This design enhances airflow from multiple directions, making it highly effective for systems where air direction might be irregular. * **pushPIN™ Attachment:** This model uses a spring-loaded pin mechanism. It provides a consistent pressure (TIM - Thermal Interface Material compression) to ensure optimal heat transfer between the component and the heat sink. * **Material Science:** Constructed from **6063 Aluminum**, which offers a balance between thermal conductivity and structural rigidity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves emissivity. --- ### 5. Common Applications This specific part is typically used for: * **Processors (CPUs/GPUs):** Small to mid-range embedded processors. * **ASICs and FPGAs:** High-speed integrated circuits that generate significant heat during logic operations. * **Power Supplies:** Cooling voltage regulators or power transistors on a PCB.