The **ATS-07G-23-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push-pin" series designed for securing the cooling element directly to a PCB (Printed Circuit Board). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Heat Sink Type** | Push-Pin | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 12.01 °C/W (at 100 LFM) | | **Dimensions** | 60.00mm x 60.00mm | | **Height** | 15.00mm | | **Mounting Hardware** | Brass Push-Pin (with Compression Spring) | --- ### 2. Key Component Breakdown #### A. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the pre-applied thermal interface. This model typically comes with **T766**, a high-conductivity phase-change material or grease that fills microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink base. #### B. Mounting Mechanism Unlike adhesive-based heat sinks, this part uses **Push-Pins and Springs**. * **Benefits:** Provides consistent downward pressure (7-10 lbs/sq inch), ensuring optimal thermal contact. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Fin Design The **Straight Fin** geometry is optimized for "forced air" environments. It allows air from a system fan to flow through the channels with minimal resistance, effectively carrying heat away from the aluminum base. --- ### 3. Electronic Applications This part is commonly used to cool high-heat generating integrated circuits (ICs) including: 1. **Microprocessors/CPUs:** In industrial embedded systems. 2. **FPGAs (Field Programmable Gate Arrays):** Which require stable thermal environments for high-speed logic. 3. **Power Supplies:** Cooling MOSFETs or power conversion modules. ---