The **ATS-07G-25-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "blueICE" or "push-pin" series designed for cooling integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-07G-25-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions (L x W x H)** | 25mm x 25mm x 25mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Application & Function While not an active electronic component (like a transistor), it is a critical **passive thermal management component**. Its role in an electronic system includes: * **Heat Dissipation:** It increases the surface area of a heat-generating component (such as a BGA, FPGA, or CPU) to allow ambient air to carry heat away more efficiently. * **Thermal Resistance:** It is designed to lower the $\theta_{ja}$ (Junction-to-Ambient thermal resistance), preventing the semiconductor from reaching its thermal throttling or breakdown temperature. * **Mechanical Security:** The "C2" designation refers to the specific push-pin and spring combination, which provides a precise amount of downward pressure (clamping force) to ensure the Thermal Interface Material (TIM) fills all microscopic gaps between the chip and the heat sink. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS-07**: Series identifier (referring to the footprint and fin geometry). 2. **G**: Indicates the specific fin height or density configuration. 3. **25**: Dimensions in millimeters (25x25mm). 4. **C2**: Indicates the kit includes a specific **Push-Pin and Spring** mounting system. 5. **R0**: RoHS compliance status (standard for modern electronics). --- ### 4. Thermal Performance The efficiency of this heat sink depends on the airflow (Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** Higher thermal resistance (e.g., ~6.0 °C/W). * **High Airflow (600+ LFM):** Lower thermal resistance (e.g., ~3.5 °C/W). This makes it suitable for small-form-factor devices where space is limited but high heat density is present.