The **ATS-07G-27-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07G-27-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.24°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Fin Style** | Straight Fin | | **Pressure Drop** | 0.20 inH2O (at 100 LFM) | --- ### 2. Key Design Components #### A. The pushPIN™ Attachment System One of the defining "electronic part" features of this model is the **pushPIN™** system. - It uses a flexible attachment mechanism consisting of a **stainless steel spring** and a **plastic/brass pin**. - This ensures constant pressure (clamping force) on the electronic chip, which optimizes thermal interface material (TIM) performance and prevents the heat sink from shifting during vibration. #### B. Material and Coating - **Aluminum Alloy:** Provides high thermal conductivity while remaining lightweight. - **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance, which is vital for long-term reliability in server or industrial environments. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced-air cooling** (fan-driven airflow). The spacing between the fins is engineered to balance the surface area for heat dissipation against the resistance it provides to the airflow (pressure drop). --- ### 3. Application Use Cases The ATS-07G-27-C2-R0 is typically used in: 1. **Telecommunications:** Cooling high-speed processors in switches and routers. 2. **Power Supplies:** Dissipating heat from MOSFETs or IGBTs. 3. **Embedded Systems:** Industrial PCs where space is limited (due to its low profile height of 12.7mm). ---